发明名称 THERMOELECTRIC ELEMENT MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric element module of excellent heat conductivity and excellent heat efficiency compared to a substrate using a general carbon material. SOLUTION: A plurality of n type semiconductors 3-1, 3-2 and 3-3, etc., and a plurality of p type semiconductors 4-1, 4-2 and 4-3, etc., are arrayed in a flat shape between carbon substrates 1 and 2 arranged facing each other, and both ends of the n type semiconductors and the p type semiconductors are alternately connected by metal electrodes 6-1, 6-2 and 6-3, etc., formed on the side of one carbon substrate 1 and metal electrodes 8-1, 8-2 and 8-3, etc., formed on the side of the other carbon substrate 2. A highly heat conductive carbon composite material is used for the carbon substrates 1 and 2 and a heat insulator 11 is filled in a gap between the carbon substrates 1 and 2. As the highly heat conductive carbon composite material, a highly anisotropic graphite/amorphous carbon composite material or an amorphous carbon/carbon nanotube composite material is used. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009141079(A) 申请公布日期 2009.06.25
申请号 JP20070315127 申请日期 2007.12.05
申请人 JR HIGASHI NIPPON CONSULTANTS KK;MITSUBISHI PENCIL CO LTD 发明人 MUTO YOSHIYASU;KOBAYASHI MITSUAKI;YAMADA SHINICHI;SUDA YOSHIHISA
分类号 H01L35/32;H01L35/30;H02N11/00 主分类号 H01L35/32
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