| 摘要 |
PROBLEM TO BE SOLVED: To divide a ceramic wafer with superior productivity while suppressing an influence on a mounting surface of the substrate and components on the mounting surface as much as possible when parting the ceramic wafer having substrate regions defined by division grooves along the division grooves. SOLUTION: The wafer 10 having the plurality of substrate regions 1 connected in a first direction (x) is fitted to a tool 20 for division. The tool 20 includes a plurality of holding portions 21 provided corresponding to the substrate regions 1 and spaced apart from one another in a second direction (y), and a coupling portion 22 coupling adjacent holding portions 21 to each other in a state wherein the adjacent holding portions 21 can be mutually displaced in a third direction (z). The tool 20 is conveyed in the first direction (x) along rails 30, and the wafer 10 is curved between adjacent holding portions 21 at bent parts 32 of the rails 30 to part the wafer 10 along a division groove 2. COPYRIGHT: (C)2009,JPO&INPIT
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