| 摘要 |
Systems and methods of coatings for semiconductor processing equipment. A semiconductor substrate processing system includes an enclosure for containing a semiconductor processing gas. The enclosure has an interior surface that is at least partially coated with a Silicon carbide coating to a desired thickness. The enclosure may be inlet piping for conveying the semiconductor processing gas to a processing chamber for processing the semiconductor substrate, a processing chamber and/or an exhaust flume for conveying used semiconductor processing gas away from a processing chamber. The interior surface may include additional coatings comprising Silicon and/or diamond like Carbon.
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