| 摘要 |
The present invention describes a method including: opening a door of a shell, the shell enclosing a stack of full-contact rings; determining a full-contact ring within the stack to engage; opening split ends of the full-contact ring to release a large wafer; lowering the large wafer from the full-contact ring; closing the split ends of the full-contact ring; extracting the large wafer from the shell; and closing the door of the shell.
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