PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and a manufacturing method thereof are provided to shorten a manufacturing process and to reduce manufacturing costs while realizing effective transmission of electric signals. A method for manufacturing a printed circuit board comprises the following steps of: selectively printing a metal alloy paste on a first metal layer to form a first bump(102); laminating an insulating layer on the first metal layer in order for the first bump to pass through the insulating layer; laminating a second metal layer on the insulating layer; and selectively etching the first metal layer so as to form an interlayer circuit electrically connected to the first bump.