| 发明名称 |
DICING SHEET, METHOD FOR MANUFACTURING DICING SHEET AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT |
| 摘要 |
<p>Provided are a dicing sheet, a method for manufacturing the dicing sheet, and a method for manufacturing an electronic component. The dicing sheet is provided with a base material sheet; an adhesive layer laminated on the base material sheet; and a ring frame adhesive layer laminated in a region where a ring frame is to be bonded to the adhesive layer. The adhesive force of the ring frame adhesive layer is higher than that of the adhesive layer. Adhesive characteristics between the dicing sheet and the ring frame are improved, while maintaining peeling easiness between the dicing sheet and the die attach film for pickup.</p> |
| 申请公布号 |
WO2009078221(A1) |
申请公布日期 |
2009.06.25 |
| 申请号 |
WO2008JP69729 |
申请日期 |
2008.10.30 |
| 申请人 |
DENKI KAGAKU KOGYO KABUSHIKI KAISHA;TAKATSU, TOMOMICHI;SAITO, TAKESHI |
发明人 |
TAKATSU, TOMOMICHI;SAITO, TAKESHI |
| 分类号 |
H01L21/301;C09J7/02 |
主分类号 |
H01L21/301 |
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