ADHESIVE SHEET FOR BONDING WAFER AND WAFER PROCESSING METHOD

摘要

Disclosed is an adhesive sheet for bonding a wafer. The adhesive sheet is composed of a base material film (1), and an adhesive layer (2), which is formed on the base material film and has a loss coefficient of 0.15 or more (at 23°C and a frequency of 1-100Hz) as a result of measuring the adhesive sheet by means of a dynamic viscoelastic measuring apparatus by using a test piece processed to have a width of 7mm. Also disclosed is a wafer processing method wherein a step of bonding a wafer to the adhesive sheet for bonding the wafer and a step of dicing the wafer are included, and a cut is not made up to the base material film of the adhesive sheet.