<p>The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle (15) and is applicable to electronic components (D) ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle (15) for picking an electronic component (D) up from a plurality of component feeding units supplying the electronic component (D) to a component pickup position and mounting the electronic component (D) on a printed board, where a mounting head (16) movable along a beam can move vertically by a head vertical movement device (33) and the suction nozzle (15) provided on the mounting head (16) can move vertically by a nozzle vertical movement device (50).
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