发明名称 ELECTRONIC DEVICE
摘要 <p>An electronic device (100) comprises case (110), printed circuit board (120), and chip (130). The printed circuit board (120) is disposed in the case (110), and has the first metal ground plate (121), the second metal ground plate (122), and metal connection member (123). The first metal ground plate (121) is opposed to the second metal ground plate (122). The metal connection member (123) is connected between the first metal ground plate (121) and the second metal ground plate (122). The second metal ground plate (122) is connected to the case (110). The chip (130) is electrically connected to the printed circuit board (120), and comprises die (131), and is bonded to the first metal ground plate (121). Heat generated by the chip (130) is conducted to the case (110) through the heat conducting member (132), the first metal ground plate (121), the metal connection member (123), and the second metal ground plate (122).</p>
申请公布号 EP2073263(A1) 申请公布日期 2009.06.24
申请号 EP20070816993 申请日期 2007.09.27
申请人 MEDIATEK INC. 发明人 CHEN, NANCHENG;CHANG, CHUNWEI;TSENG, CHAOWEI
分类号 H01L23/34;G06F1/20;H05K7/20 主分类号 H01L23/34
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