METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PLASTIC PACKAGE USING THE SAME

摘要

A manufacturing method of a multilayer printed circuit board and a semiconductor plastic package using the same are provided to prevent cracks of a substrate and a semiconductor chip and to suppress a defect due to warpage by preventing the damage of the semiconductor chip and buffering stress of a connecting agent. A first substrate forming process is performed to form a first substrate(110). A second substrate forming process is performed to form a pair of second substrates(120). The second substrates are separated from each other in order to form an opening(160). The second substrates are attached on one side of the first substrate in order to be electrically connected with the first substrate. An electronic element is mounted in the opening. The electronic element is connected with the first substrate in a flip-chip manner.