| 摘要 |
In a method of forming a concentration solar cell chip packaging structure, at least one solar cell chip 21 is mounted on an electrically conducting plate 20, and the solar cell chip 21 along with the conducting plate 20 are encapsulated in a package 22 made of a highly light-pervious and shock-absorbing polymer material. Moreover, a thin layer of low-iron, high-strength, and light-pervious material 23 is attached to an outer surface of the polymer package 22. With the above method, the concentration solar cell chip packaging structure may be formed with shortened processing time and improved processing quality to give the packaged solar cell increased light transmittance and prolonged usable life. |
