| 摘要 |
<p>A wafer level semiconductor package and a manufacturing method thereof are provided to protect a wafer of a single crystalline silicon structure and to prevent a breakdown of a wafer during a manufacturing process by forming a molding layer on one surface of the wafer. A wafer level semiconductor package is manufactured by forming a semiconductor package on a wafer. The wafer level semiconductor package includes a semiconductor chip(120), a conductive electrical connection unit, and a molding layer(300). One or more contact pads(110) are formed on one surface of the semiconductor chip. The conductive electrical connection unit is attached on the contact pad of the semiconductor chip. The molding layer is formed on the other surface of the semiconductor chip.</p> |
