An apparatus for making etching area on a substrate is provided to reduce the occupying space inside a chamber unit by simplifying the pipe structure of the absorption fixing part. A chamber unit(2) has an enclosure(S) of the fixed level. A stamp(4) is positioned inside the chamber unit. A pattern surface(4-1) is formed in the single-side of stamp to classify the etching region and non-etching domain. A back plate(4-2) is adhered to the other side of stamp. A holder(6) fixes the stamp. A substrate(G) is loaded on the stage(8). An absorption fixing part(12) comprises a plurality of absorption members(12-1). A plurality of absorption members vacuum absorbed with a single side of the back plate of stamp. A plurality of vacuum flow passages(14-2) is formed in the vacuum flow passage shaping section(14). The pressure generator(16) generates the vacuum suction force through a plurality of vacuum flow passages in the absorption fixing part. A driving unit(18) diversifies the location of the absorption fixing part.
申请公布号
KR20090066456(A)
申请公布日期
2009.06.24
申请号
KR20070133983
申请日期
2007.12.20
申请人
DMS CO., LTD.
发明人
SHIN, TAE KYOUNG;OH, SANG TAEK;PARK, CHUN SEONG;LEE, JIN HYANG;JUNG, CHANG HO