| 摘要 |
A small, thin camera module is provided in which a chipset made up of the image pickup element ( 13 ), etc., is sealed with the transparent resin ( 15 ) wherein a camera module ( 10 ) is made up of a conductive pattern ( 11 ); a signal processing element ( 12 ) having a surface on which an element is formed and which is shielded from light by being mounted facedown on the conductive pattern ( 11 ); an image pickup element ( 13 ) fixed onto the signal processing element ( 12 ); a thin metal wire ( 16 ) by which an electrical connection is established between the image pickup element ( 13 ) and the conductive pattern ( 11 ); a transparent resin ( 15 ) with which the signal processing element ( 12 ), the image pickup element ( 13 ), and the thin metal wire ( 16 ) are covered; and a lens ( 24 ) situated above the image pickup element ( 13 ). |
