发明名称
摘要 PROBLEM TO BE SOLVED: To relatively swing a work and a surface plate by a simple swinging mechanism in a both-face polishing device for polishing the both faces of the work by two surface plates with diameter smaller than that of the work. SOLUTION: This swinging type both-side polishing device is provided with a plurality of support rollers 40 rotatably supporting the outer circumference of a disk work W, a pair of opposed surface plates 11a and 11b with diameter smaller than the work whose both sides are polished in a position near the end, a polishing vessel 39 surrounding the circumference of the work W and the surface plates 11a and 11b, and a pair of swinging mechanisms 43 relatively swinging the work W and the surface plates 11a and 11b in the radial direction of the work W. The support roller 40 is fitted to the polishing vessel 39, and the swinging mechanism 43 is provided with a linear guide 44 extending in the radial direction of the work W, a swinging table 45 movable along the linear guide 44, and a table drive means 46 reciprocating the swinging table 45 along the linear guide 44. The polishing vessel 39 is attached to the swinging table 45 so that the work W is swung via the polishing vessel 39.
申请公布号 JP4285888(B2) 申请公布日期 2009.06.24
申请号 JP20000158493 申请日期 2000.05.29
申请人 发明人
分类号 B24B9/00;B24B37/08;H01L21/304 主分类号 B24B9/00
代理机构 代理人
主权项
地址