METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

摘要

A method for manufacturing a printed circuit board is provided to correct and secure adhesive strength of conductive ink in an ink-jet manner by using an improved manufacturing method. A prepreg preparation process is performed to prepare a prepreg. A polymerization reaction process is performed to execute a polymerization reaction by applying heat to the prepreg until the polymerization reaction of the prepreg approaches 50 to 90%. A wiring manufacturing process is performed to manufacture a wiring by injecting conductive ink onto the prepreg. A polymerization reaction completion process is performed to complete the polymerization reaction of the prepreg. The prepreg is selected from a group including a poly resin substrate, an epoxy resin substrate, a composite base material substrate, and a flexible substrate.