| 摘要 |
<p>A ceramic-copper foil bonding method includes wet-oxidizing a copper foil (1,3,4) such that a surface of the copper foil (1,3,4) is oxidized to a copper oxide layer (11,31,41), contacting the copper oxide layer (11,31,41) with a surface of a ceramic substrate (2,5), and bonding the copper oxide layer (11, 31, 41) of the copper foil (1,3,4) to the surface of the ceramic substrate (2,5) by heat treatment. Preferably, a protective layer is provided on an opposite surface of the copper foil (1,3,4) so that the opposite surface is not oxidized during wet-oxidizing the copper foil (1,3,4).</p> |
