FLEXIBLE COPPER CLAD LAMINATE HAVING HIGH ADHESION WITHOUT ADHESIVE AND CONTINUOUS FABRICATION THEREOF

摘要

A high-adherent non-adhesive flexible printed circuit board and a method for manufacturing successively the same are provided to reduce an undercut and an aspect ratio of a copper layer in an etch process by preventing thermal diffusion of Cu and enhancing a heat-resisting property. A high-adherent non-adhesive flexible printed circuit board includes a two-layer flexible printed circuit board. The two-layer flexible printed circuit board includes a polyimide substrate, a copper seed layer, and a copper thin film layer. The copper seed layer and the copper thin film layer are formed on the polyimide substrate. The two-layer flexible printed circuit board includes a first layer as an adhesive layer and a second layer. The first layer includes Ti. The second layer includes Ni. The two-layer flexible printed circuit board has initial adhesive strength of 1kgf/cm and more. The two-layer flexible printed circuit board has high adhesive strength of 0.6kgf/cm and more.