Polyaldimine containing moisture curable hotmelt adhesive composition

摘要

Moisture-reactive hot melt adhesive compositions containing solid polyurethanes with isocyanate groups, plus polyaldimines and mono- or di-carboxylic or -sulfonic acids or their hydrolysable derivatives. Independent claims are also included for (1) a method (M1) for bonding substrates S1 and S2 by heating the HMA to 80-200 (preferably 120-160) [deg] C, applying the hot HMA to S1 and contacting the adhesive layer with S2 (S1 and S2 may be of the same or different material) (2) articles bonded by this method (3) a method for reducing the formation of voids and accelerating the crosslinking of amorphous (preferably transparent) HMA by adding the components ALD and K to an amorphous polyurethane (P) .