发明名称 CONSECUTIVE SUBSTRATE PROCESSING SYSTEM
摘要 A consecutive substrate processing system is provided to process uniformly a large-sized target substrate by using a plurality of partition electrodes for generating uniformly plasma. A consecutive substrate processing system(200) includes a plurality of process chambers(210, 220, 230) and a multi-partition electrode assembly(30). The process chambers are arranged continuously in order to perform a substrate process for processing continuously target substrates(102, 112). A multi-partition electrode assembly includes a plurality of partition electrodes for inducing plasma discharge to the process chambers. A loading chamber is connected to a front end of an array of the process chambers. An unloading chamber is connected to a rear end of the array of the process chambers.
申请公布号 KR20090066996(A) 申请公布日期 2009.06.24
申请号 KR20070134764 申请日期 2007.12.20
申请人 DYNAMIC SOLAR DESIGN CO., LTD. 发明人 WI, SOON IM
分类号 H01L21/205 主分类号 H01L21/205
代理机构 代理人
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