发明名称 COOLING WATER PRESSURE CONTROLLING APPARATUS AND METHOD FOR CHEMICAL VAPOR DEPOSITION PROCESS CHAMBER
摘要 A cooling water pressure control apparatus of a process chamber for chemical vapor deposition and a controlling method are provided to measure pressure of cooling water by installing pressure gauges on a cooling water inflow line and a cooling water outflow line. A cooling water pressure control apparatus of a process chamber for chemical vapor deposition includes pressure gauges(41,42,43,44), a control unit(50), and an alarm generation unit(60). The pressure gauges are installed on a cooling water circulation line. The pressure gauges are formed to measure the pressure of the cooling water. The control unit compares the cooling water pressure measured by the pressure gauges with the predetermined reference pressure in order to determine an optimum level of the cooling water pressure. The alarm generation unit is connected to the control unit. The alarm generation unit generates an alarm signal when the cooling water pressure exceeds the reference pressure.
申请公布号 KR20090066975(A) 申请公布日期 2009.06.24
申请号 KR20070134733 申请日期 2007.12.20
申请人 DONGBU HITEK CO., LTD. 发明人 PARK, IN CHEON
分类号 H01L21/205;H01L21/00;H01L21/02;H01L21/66 主分类号 H01L21/205
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