| 摘要 |
Gel for light emitting diode packaging is provided to lower light attenuation of a light emitting diode and to prolong the lifetime of the light emitting diode. Gel for light emitting diode packaging comprises a first composition and a second composition. The first composition represents polydimethylsiloxane. The second composition contains 94-99wt% of copolymer. The copolymer consists of 84-90wt% of dimethyl siloxane, 4-9wt% of methyl hydroxy siloxane and 2-7wt% of vinylsiloxane. The desirable contents of the copolymer, demethyl siloxane, methyl hydroxy siloxane and vinylsiloxane are 98wt%, 87wt%, 7wt% and 4wt%. The second composition additionally contains 0.5-3wt% of r-(2,3-epoxypropoxy)propyltrimethoxysilane(r-glycidoxypropyltrimethoxysilane).
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