METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A manufacturing method of a semiconductor device is provided to prevent generation of filling and cracks and to enhance second mounting reliability by removing a broken layer as a starting point of the filling or cracks of a sealing resin. A plurality of semiconductor devices are formed on a semiconductor wafer(10). The semiconductor device forming surface of the semiconductor wafer is sealed with a resin. The semiconductor wafer is divided into semiconductor devices in order to form the semiconductor devices. An area of a scribe line(14) between the adjacent semiconductor devices of the semiconductor wafer is scrapped thinly. A laser irradiation process is performed to irradiate a laser beam on a broken layer of the area of the scribe line in order to recrystallize the broken layer. The scrapping process and the laser irradiation process are performed after the semiconductor device forming process and before the resin sealing process.