SEMICONDUCTOR WAFER CHUCK OF A PROCESS CHAMBER

摘要

A wafer chuck of a process chamber is provided to prevent an influence on water patterns and to increase a yield by minimizing impact and force applied to a wafer in order to fix the wafer. A wafer chuck of a process chamber includes a chuck(110), a clamp ring(120), an elevating unit(130), and a line contact fixing unit(140). The chuck is installed in an inside of a process chamber(1). The chuck has a loading surface(111) on which a wafer(W) is loaded. The clamp ring is installed at an upper side of the chuck in order to be elevated. The elevating unit elevates the clamp ring. The line contact fixing unit is formed at a lower side of the clamp ring. The line contact fixing unit comes in linear contact with an upper edge of the wafer in a falling state of the clamp ring, in order to fix the wafer.