SEMICONDUCTOR DEVICE AND METHOD OF FORMING INTEGRATED PASSIVE DEVICE MODULE

摘要

A method for forming a semiconductor device and an integrated passive device module is provided to reduce a fabrication cost and to enhance total repeatable quality. An insulating layer is formed on a top end of a substrate(16). An integrated passive circuit is formed on the top end of the substrate. A wafer carrier bonding process is performed to bond a wafer carrier on the integrated passive circuit. A substrate removal process is performed to remove the substrate. A deposition process is performed to deposit an insulating polymer film on the insulating layer. An interconnecting structure is formed on an upper surface of the insulating polymer film layer.