METHOD OF FABRICATING AN ULTRA THIN PACKAGE SUBSTRATE

摘要

A method for manufacturing ultra-thin package substrates is provided to prevent a substrate from being bent in a substrate processing step while keeping the substrate ultra-thin. A method for manufacturing ultra-thin package substrates comprises the following steps of: copper-plating the top, bottom and side of a core substrate, which is coated with a copper foil and coating a copper foil on the exposed side of an insulating layer; laminating the insulating layer and the copper foil on the core substrate and selectively opening a third copper foil to form a hole; charging a first hole with solder(132) plating; copper-plating the whole substrate to form a fourth copper foil; capping the top of the hole with the fourth copper foil; charging a second hole with copper plating to form a pad; pasting insulating ink or solder resist on the surface of the substrate and Ni/Au-plating the exposed surface of the copper-plating pad; and etching the substrate in an alkali etching solution to remove a second copper foil.