| 摘要 |
<p>An anti-peeling bonding pad and a forming method thereof are provided to prevent a peeling effect of a bonding pad in a wire bonding process by reducing a contact area between an insulating layer and a conductive pattern. A conductive pattern(25) is formed on an upper surface of an insulating layer(22). A bonding process is performed to bond the conductive pattern on the insulating layer. The dummy pattern penetrates the insulating layer. A part of the dummy pattern is inserted in a bottom surface of the conductive pattern. The insulating layer includes a recess pattern. A contact region between the conductive pattern and the dummy pattern is formed in the inside of the recess pattern. An adhesive layer is formed on a sidewall of the recess pattern.</p> |
