| 摘要 |
<p>A photosensitive polymer and a resist composition containing the same are provided to improve adhesion properties of thin films as well as etching resistance of resist. A photosensitive polymer has repeat units represented by the formula 1~3. In the formula 1~3, k is an integer of 0 or 1; x is an integer of 0 or 2; R1 and R3 are hydrogen atoms or methyl groups; R2 is C4-C20 acid-labile group decomposable in the presence of acid catalyst; R4 is lactone derivative group; R5 is selected from the group consisting of hydrogen, halogen element, alkyl group, alkoxy group, aryl group and their combination; and l/(l+m+n)=0.1~0.5, m/(l+m+n)=0.3~0.5 and n/(l+m+n)=0.1~0.4.</p> |
