| 摘要 |
A method of forming an identification code for wire bonders is revealed. Firstly, a chip with a plurality of bonding pads is provided and is disposed on a chip carrier with a plurality of bonding fingers. A binary-code baseline is defined on the chip carrier to divide each of the bonding fingers into a first coding area adjacent the bonding pads and a second coding area far away from the bonding pads. Then, a plurality of bonding wires are formed by wire bonding to electrically connect the bonding pads to the bonding fingers and an ID code for wire bonders is formed at the same time where each bonding wire has an end selectively bonded to either the first coding area or the second coding area of the corresponding bonding finger to form an ID code for wire bonders. Since the ID code for wire bonders is constituted by the selected locations of the ends of the bonding wires, the ID code do not get lost or damaged during packaging processes nor contaminate the packages. The ID code for wire bonders can be used to easily and quickly track malfunction wire bonders to save the identification time.
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