| 摘要 |
A substrate processing apparatus and a substrate processing method are provided to improve the processing amount of substrates by shortening a substrate transfer time. A wet cleaning unit(200) injects a processing fluid onto a substrate and cleans the substrate by using the processing fluid. A plasma processing unit is installed at one side in a lateral direction of the wet cleaning unit. The plasma processing unit performs a plasma process for the substrate. A transfer unit transfers the substrate in a straight direction from the plasma processing unit to the wet cleaning unit. A base includes a bottom wall and a sidewall perpendicular to the bottom wall. The wet cleaning unit is installed on the bottom wall. The plasma processing unit is installed on the sidewall.
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