System and method for cooling an electronic component

摘要

A cooling system has at least one heat conducting element in thermal contact with an electronic component. A heat exchanger is in fluid communication with the heat conducting element. The heat exchanger is configured to provide a working fluid to the at least one heat conducting element to facilitate dissipation of heat from the respective electronic component. The heat exchanger has a form factor dimensioned and configured for mounting in a preconfigured hardware unit slot of a computer chassis.