发明名称 Chemical mechanical polishing composition
摘要 A chemical mechanical polishing composition includes: an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, and water. The metal residue inhibitor is selected from the group of compounds having the following formulas: and combinations thereof, wherein R1, R2, R3, and R4 are independently selected from H, C1-C6 alkyl, C2-C6 alkenyl, and C2-C6 alkylidyne; and R5, R6, R7, R8, R9, and R10 are independently selected from H and C1-C6 alkyl.
申请公布号 US7550092(B2) 申请公布日期 2009.06.23
申请号 US20060454981 申请日期 2006.06.19
申请人 EPOCH MATERIAL CO., LTD. 发明人 HOU HUI-FANG;LIU WEN-CHENG;CHEN PAO-CHENG;CHEN YEN-LIANG;CHEN JUI-CHING
分类号 C09K13/00 主分类号 C09K13/00
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