| 摘要 |
A film substrate including a fine circuit and a manufacturing method thereof are provided to form stably a fine circuit thereon by performing a simple manufacturing process. A master preparation process is performed to prepare a master including an embossing fine circuit pattern formed at least one surface thereof(S110). A releasing agent is coated on a residual region except for a depressed fine circuit pattern region of a film substrate(S130). The master is removed from the film substrate(S140). A sputtering process is performed to fill up a metal in the fine circuit pattern. A removal process is performed to remove the releasing agent from the fine circuit pattern except form the metal included in the fine circuit pattern.
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