发明名称 Nonplanar device with thinned lower body portion and method of fabrication
摘要 A nonplanar semiconductor device having a semiconductor body formed on an insulating layer of a substrate. The semiconductor body has a top surface opposite a bottom surface formed on the insulating layer and a pair of laterally opposite sidewalls wherein the distance between the laterally opposite sidewalls at the top surface is greater than at the bottom surface. A gate dielectric layer is formed on the top surface of the semiconductor body and on the sidewalls of the semiconductor body. A gate electrode is formed on the gate dielectric layer on the top surface and sidewalls of the semiconductor body. A pair of source/drain regions are formed in the semiconductor body on opposite sides of the gate electrode.
申请公布号 US7550333(B2) 申请公布日期 2009.06.23
申请号 US20060440313 申请日期 2006.05.23
申请人 INTEL CORPORATION 发明人 SHAH UDAY;DOYLE BRIAN;BRASK JUSTIN K.;CHAU ROBERT S.;LETSON THOMAS A.
分类号 H01L21/84 主分类号 H01L21/84
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