| 摘要 |
A chemical mechanical polishing apparatus for manufacturing a semiconductor device is provided to prevent reduction of polishing efficiency due to lumps of slurries and to form uniformly a polishing degree of a wafer by absorbing the slurries used for a polishing pad and particles generated from polishing and conditioning processes in a vacuum state. A chemical mechanical polishing apparatus for manufacturing a semiconductor device includes a polishing platen, a polishing head, and a supply and suction module(130). A polishing pad is attached to an upper side of the polishing platen. The polishing platen is rotatably installed by a driving unit. The polishing head is installed on the polishing pad. The polishing head rotates a wafer attached closely on the polishing pad. The supply and suction module is installed on the polishing pad. The supply and suction module supplies slurries and ultra-pure water to the polishing pad. The supply and suction module sucks the slurries or particles from an upper surface of the polishing pad in a vacuum state.
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