DEPOSITION APPARATUS AND DEPOSITION METHOD

摘要

A deposition apparatus and a deposition method are provided to enhance uniformity of a layer in a deposition process by forming a temperature gradient within a substrate. A deposition apparatus(100) is positioned at a place which is opposite to a first electrode. A processing target is loaded on the first electrode. A second electrode is formed to generate plasma. The processing target is used for absorbing the heat between the second electrode and the first electrode. An electrical heating unit controls a heat flow by generating the heat flow to a peripheral region. The electrical heating unit is positioned in a central region of the processing target.