The manner of positioning of enclosure of an electronic element, especially integrated system with single- or multi-layer or package structure on silicone or ceramic substrate type IC, SiP or MCM

摘要

Disclosed herein is a method of positioning and placing an integrated circuit on corresponding pads of a printed circuit board. The integrated circuit comprises first geometrical elements. The first geometrical elements are of one or more predefined shapes and are located on one or more predefined surfaces of the integrated circuit. The printed circuit board comprises second geometrical elements. The second geometrical elements are shaped to accommodate the first geometrical elements. The first geometrical elements fit into the second geometrical elements. The first geometrical elements come in contact with the second geometrical elements at two or more points. Placing the first geometrical elements into the second geometrical elements limits displacement of connections of the integrated circuit with corresponding pads of the printed circuit board.