| 摘要 |
<p>A light emitting diode package is provided to simplify a connection structure with an external terminal by using an external electrode of a silicon wafer. An electrode layer is formed on a silicon wafer(110). The electrode layer comprises a first internal electrode, a second internal electrode, a first external electrode(121), and a second external electrode(123). The first internal electrode and the second internal electrode are formed on a top surface(112) of the silicon wafer. A light emitting diode chip(130) is adhered in the first internal electrode and the second internal electrode. The light emitting diode chip is bonded by a wire. The light emitting diode chip is connected to the first internal electrode and the second internal electrode through a conductive adhesive or the wire. The first external electrode and the second external electrode are connected to the first internal electrode and the second internal electrode. A light transmitting resin material(140) of a lens shape or a dome shape is formed on the light emitting diode chip.</p> |
