发明名称 CIRCUIT CONNECTING MATERIAL AND CONNECTION STRUCTURE OF CIRCUIT MEMBER
摘要 A circuit-connecting material, and a connection structure of a circuit member are provided to prevent the shortage due to the agglomeration of conductive particles and to improve connection reliability. A circuit-connecting material(1) of two layers which is interposed between the circuit electrodes(2,6) facing each other and connects electrically the electrodes of the pressurization direction by pressurizing the circuit electrodes facing each other. The circuit-connecting material has a laminated structure comprising an anisotropic conductive adhesive layer where a conductive particle is dispersed, and an insulating adhesive layer, wherein the average diameter a of the conductive particle and the thickness b of the anisotropic conductive adhesive layer satisfy the relation of the mathematical equation represented by a>=b.
申请公布号 KR20090065462(A) 申请公布日期 2009.06.22
申请号 KR20080128345 申请日期 2008.12.17
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TATSUZAWA TAKASHI;KOBAYASHI KOUJI;FUJINAWA TOHRU;ARIFUKU MOTOHIRO;ITO AKIHIRO;SEKI KOTARO
分类号 C09J9/02;C09J7/00;H01L21/60 主分类号 C09J9/02
代理机构 代理人
主权项
地址