| 摘要 |
A stackable semiconductor package includes a top package, a bottom package, an adhesive layer, a plurality of wires and a molding compound. A part of a surface of a chip of the bottom package is exposed. The top package is inverted, and is adhered to the chip of the bottom package with the adhesive layer. The wires electrically connect a substrate of the bottom package and a substrate of the top package. The molding compound encapsulates the top package, the bottom package, the adhesive layer,and the wires, and exposes a part of a surface of the substrate of the top package. Thus, the stackable semiconductor package includes at least two chips, thereby increasing the chip density and improving the applicability.
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