| 摘要 |
A technique for reducing the number of layers in a multilayer circuit board is disclosed. The multilayer circuit board (10) has a plurality of electrically conductive signal layers (16) for routing electrical signals to and from at least one electronic component mounted on a surface of the multilayer circuit board (10). The method comprises the steps of: forming a plurality of electrically conductive vias (20,26) in the multilayer circuit board (10) extending from the surface (12) of the multilayer circuit board (10) to at least one of the plurality of electrically conductive signal layers (16); arranging the surface (12) such that a first set of two power/ground pins corresponds to first via and a second set of two power/ground pins corresponds to a second via positioned adjacent the first via, thereby creating a channel on the surface (12) and every layer below which includes a channel on a first (16a) of the plurality of signal layers (16), and routing a first plurality of electrical signals through the channel on the first (16a) of the plurality of electrically conductive signal layers (16). <IMAGE> |
