| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To manufacture a part built-in wiring board having a semiconductor chip buried and mounted in an insulating plate by flip-chip connection, inexpensively while securing reliability of the flip-chip connection and functionalities as the wiring board. <P>SOLUTION: The part built-in wiring board includes a first insulating layer, a second insulating layer positioned in a laminated shape over the first insulating layer, a semiconductor chip buried in the second insulating layer and having a terminal pad, a wiring pattern sandwiched between the first insulating layer and the second insulating layer, including a mounting land for the semiconductor chip, and having a roughened surface on the second insulating layer side, a conductive bump disposed between a terminal pad of the semiconductor chip and the mounting land of the wiring pattern and electrically and mechanically connecting the terminal pad and mounting land to each other, and a resin provided between the semiconductor chip and first insulating layer, and the wiring pattern. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
