| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To maintain a high connectivity to both of a semiconductor device and a mounting board at a low cost without increasing any parts count and any manufacturing process, in a wiring board having a structure of laminating a first board and a second board, a semiconductor device, and a method of manufacturing the wiring board. <P>SOLUTION: The wiring board has a structure of laminating: a first board 2 (silicon interposer) having a via connection pad 10; and a second board 3 (buildup board) having an inter-board connection via 18X, wherein in a connecting position of the first board 2 and the second board 3, the via connection pad 10 and the inter-board connection via 18X are constituted to be directly connected. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
