| 发明名称 |
METHOD AND APPARATUS FOR CUTTING PROTECTIVE TAPE OF SEMICONDUCTOR WAFER |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To adequately removing dusts generated in a process of cutting a protective tape of a semiconductor wafer by cutting off along the wafer contour the protective tape attached on the surface of the semiconductor wafer in a method for cutting protective tape of the semiconductor wafer. <P>SOLUTION: While relatively moving a cutter blade 12 along the outer periphery of a semiconductor wafer W, dusts generated at the tape cutting portion by the cutter blade 12 and adhered on the upper surface of the protective tape T are swept and collected by a dust collecting member 56 to be moved relatively to the semiconductor wafer W together with the cutter blade 12. After finishing the tape cutting operation, the dusts swept and collected at a predetermined position are vacuumed and removed with a suction nozzle 61. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
| 申请公布号 |
JP2009130270(A) |
申请公布日期 |
2009.06.11 |
| 申请号 |
JP20070306104 |
申请日期 |
2007.11.27 |
| 申请人 |
NITTO SEIKI KK;NITTO DENKO CORP |
发明人 |
ISHII NAOKI;YAMAMOTO MASAYUKI |
| 分类号 |
H01L21/683;B26D3/10;B26D7/18;H01L21/02;H01L21/304 |
主分类号 |
H01L21/683 |
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