| 摘要 |
This method for soldering or hybridizing two components (1, 2) together using a solder material, at least one (1) of said components, called first component, comprising one or more electrically conducting metal tracks (4), connected to as many outer connection dots (5), consists in: preparing, on the opposing surfaces of the components to be welded or hybridized, a wettability surface (7, 8); depositing on one of said wettability surfaces an appropriate quantity of solder material, suitable for constituting a soldering or hybridization dot (6); contacting the wettability surface (8) of the other component (2) with the solder material thereby deposited; then raising the temperature of the chamber in which the components to be welded or hybridized are positioned, to at least the melting point of the solder material in order to ensure the effective soldering or hybridizing of the two components together by a remelt effect. It further consists in depositing on said first component (1) and in contact with said conducting track (4), another quantity (11) of said solder material, constituting a sacrificial dot (10), having a contact area with said first component that is higher than that of said first quantity intended to constitute the soldering or hybridizing dot (6).
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