| 摘要 |
A method of forming a printed circuit by using a printing method is provided. Method of forming the printed circuit, which instead of using the copper etching method, uses an adhesive to adhere to the metal powder, and then to solidify the metal powder. In detail, a patterned silk screen (corresponding to the through pattern of a predetermined printed circuit wiring) and a base material are provided. The adhesive is printed onto the base material using the patterned silk screen, and an adhesive layer which is patterned is formed onto the base material. Then, the metal powder is incorporated into the adhesive layer, and solidified inside the adhesive layer to form the printed circuit.
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