PHOTOSENSITIVE ADHESIVE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要
Disclosed is a method for manufacturing a semiconductor device (1). The method has a first step of arranging a photosensitive adhesive (insulating resin layer (7)) on a substrate (3) having a connecting terminal; a second step of patterning the photosensitive adhesive by exposure and development so as to form an opening (13) from which the connecting terminal is to be exposed; a third step of forming a conductive layer (9) by filling the opening (13) with a conductive material; and a fourth step of directly bonding a semiconductor chip (5) having a connecting electrode section to the photosensitive adhesive and electrically connecting the connecting terminal of the substrate (3) and the connecting electrode section of the semiconductor chip (5) to each other with the conductive layer (9) in between.
申请公布号
WO2009072493(A1)
申请公布日期
2009.06.11
申请号
WO2008JP71883
申请日期
2008.12.02
申请人
HITACHI CHEMICAL COMPANY, LTD.;MASUKO, TAKASHI;KAWAMORI, TAKASHI;MITSUKURA, KAZUYUKI;KATOGI, SHIGEKI