A fabrication method of MEMS structure is provided to block the diffusion of stress or crack generated in a part of MEMS structures. A fabrication method of MEMS structure comprises a step of preparing a substrate(10), a step of forming a sacrificial layer(11) on the top of the substrate, including empty regions, and a step of forming a device in the empty region of the sacrificial layer. Lattice grooves(20) are located between the empty regions of the sacrificial layer in at least one direction, where the width of the lattice groove is 0.5~2 times the thickness of the sacrificial layer.
申请公布号
KR20090059771(A)
申请公布日期
2009.06.11
申请号
KR20070126806
申请日期
2007.12.07
申请人
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
发明人
CHO, SEONG MOK;RYU, HO JUN;YANG, WOO SEOK;CHEON, SANG HOON;YU, BYOUNG GON;CHOI, CHANG AUCK