| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To make a resin, which has not hit a fiber bundle owing to the fiber splitting conventionally, adhere to the fiber bundle in a resin adhesion apparatus, in the filament winding molding. <P>SOLUTION: The resin adhesion apparatus 5 in the filament winding molding includes a droplet ejection device 11 having a plurality of resin ejection nozzles 29a and 29b and a travel device 10 which makes the fiber bundle 100 travel at prescribed opposite distances from the nozzles 29a and 29b, makes a resin 8 (a main agent 12 and a curing agent 15) adhere to the fiber bundle 100 by ejecting the resin 8 toward the surface of the traveling fiber bundle 100 by the resin ejection device 11, and has a resin receiving parts 40a and 40b which are arranged to approach the back of the fiber bundle 100 at opposite positions to the nozzles 29a and 29b with the fiber bundle 100 held between them. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
