| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding apparatus capable of shortening a stop time caused by a bonding tool. SOLUTION: A cleaning mechanism 52 is provided in this bonding apparatus 1, and a removing tool 72 to remove a chip 2 which a bonding tool 13 has carried back is provided on the first side face 71 of the rotary head 68 of a tool cleaning mechanism 52. A polishing tool 92 to polish the chip holding surface 21 of the bonding tool 13 is provided on the second side face 91 of the rotary head 68 so that the chip holding surface 21 of the bonding tool 13 can be polished. A cleaning tool 102 to clean the chip holding surface 21 of the bonding tool 13 is provided on the third side face 101 of the rotary head 68 so that shavings on the chip holding surface 21 can be removed by brush fiber by vertically moving the chip holding surface 21 of the bonding tool 13 against the cleaning tool 102. COPYRIGHT: (C)2009,JPO&INPIT
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